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The MAX17227A features True Shutdown mode where the output disconnects from the input with no forward or reverse-current.
This saves precious energy from the battery for systems that dynamically start and off insurance firms the opportunity to startup into a precharged output capacitor.
This board demonstrates the MCP16331 in a buck-converter application with two selectable output voltages.
The MAX13042E–MAX13045E can be purchased in 12-bump UCSP™ (1.54mm x 2.12mm) and 14-pin TDFN packages, and operate over the extended -40°C to +85°C temperature range.

The state of I/O VCC_ and I/O VL_ during shutdown is chosen by selecting the appropriate part version.
(Start to see the Ordering Information/Selector Guide in the full data sheet).
The MAX25302 evaluation kit evaluates the MAX25302A/MAX25302B IC category of low-noise linear regulators.
The EV kit operates over an input range of 1.7V to 5.5V, provides any output voltage range from 0.6V to 5.3V, and delivers around 2A of current.
Available package ranges from 2.0×1.5mm to 9.0×9.0mm in proportions.
The dimensional tolerance and positioning accuracy affects subsequent processes as the package size shrinks and the lead count increases.

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Because the DFN has no leads and contains shorter bond wire lengths, it offers a higher electrical performance than leaded packages because of less inductance.
The normal size body size includes a length that ranges from 2mm to 9mm.
Because dual flat no-lead package has no leads and contains shorter bond wire lengths, it provides a higher electrical performance than leaded packages due to less inductance.
As configured, the EV kit dedicates two channels for translation between VL to VCC and two channels for translation between VCC to VL.

  • When making the PCB layout, make reference to the case outline drawing to get the package dimensions and tolerances.
  • The MAX17227A is offered in a space-saving and costeffective 1.58mm x 0.89mm, 6-bump WLP (3 x 2, 0.4mm pitch) and 8-pin, 2mm x 2mm TDFN packages.
  • A very small square-shaped or rectangular surface-mount plastic package with no leads.
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If a model is not available for web samples, look for notes on the merchandise page that indicate how to request samples or Contact ADI.
The MAX17227A offers ultra-low quiescent current, small total solution size, and high efficiency through the entire load and line range.
The MAX17227A is fantastic for battery-powered applications

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soft-start rate, output overcurrent, and thermal-overload protection.
The output voltage on MAX25302B could be adjusted to a value in the number of 0.6V to 5.0V through the use of two external resistors.
The MAX25302B also contains an active-high POK signal for trouble-free load startup.
This is the set of Product Change Notifications and Product Discontinuance Notifications published on the net for this model.
Online PCNs are available starting in 2009 2009 and online PDNs are available starting in 2010 2010.
To obtain older PCNs or PDNs, contact your ADI MERCHANT. For additional information on ADI’s PCN/PDN process, please visit our PCN/PDN Information page.

DFN packages will often have pad counts that range between 3 to 32.
The normal DFN body size has a length that ranges from 2 mm to 7 mm.
A thinner version of the DFN exists and is known as the TDFN.

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The MAX17227A WLP evaluation kit evaluates the MAX17227A IC in a WLP package.
The MAX17227A is really a nanoPower Boost converter with 2A peak inductor current limit and contains True Shutdown™ mode.
The EV kit operates over an input selection of 400mV to 5.5V, based on load, with 0.88V typical startup with 3kΩ load.
The EV kit provides resistor-configurable output voltages from 2.3V to 5.5V.
Refer to the MAX17227A IC data sheet for output voltage setting.
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Select the purchase button to display inventory availability and online purchase options.The Sample button will be displayed if a model is available for web samples.

An Evaluation Board is a board engineered showing the performance of the model, the part is roofed on the board.
The MAX17227A emerges in a space-saving and costeffective 1.58mm x 0.89mm, 6-bump WLP (3 x 2, 0.4mm pitch) and 8-pin, 2mm x 2mm TDFN packages.
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Sample availability may be much better than production availability.
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Metal pads or lands along two sides of the bottom of the package serve as electrical connection points to the exterior world.
It is much like QFN, except that the latter has lands all around the periphery of the package instead of just two sides like the dual flat no-lead.

In subsequent processes, the PCB layout and stencil designs are critical to ensure sufficient solder coverage between your package and the printed circuit board .
When designing the PCB layout, refer to the case outline drawing to obtain the package dimensions and tolerances.
THE UNITED STATES list pricing shown is for budgetary use only, shown in USA dollars , and is at the mercy of change.

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